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>>> Anti-static protective tape is also known as PE black conductive tape, black conductive roll
film, roll spacer protective film, black conductive coil film tape, strip chip card separator diaphragm
and so on.
This product is made of our exclusive formulation of black conductive polyethylene material,
with good electrostatic discharge performance and mechanical properties, tightly wound with the
protected product, no matter how long it is placed, it will not drop powder and dust, and will not
form macula or other impurities on the surface of the product.
Performance Advantages: It has excellent electrostatic discharge performance and mechanical properties, which can effectively protect sensitive products from electrostatic damage while having a stable physical structure.
Quality Assurance: After being tightly wrapped around the protected product, it will not shed powder, accumulate dust no matter how long it is placed, and will not form yellow spots or other impurities on the product surface, avoiding product contamination.
Appearance Features: The surface is smooth, flat, and free of wrinkles, with a matte texture and no particles, so it will not scratch the protected products (such as OPC drum cores, outer surfaces).
Customization Capability: Supports customization of parameters such as resistance, surface resistance, width, and length to meet the usage needs of different scenarios.
Model | Product | Surface resistance range （Ω/Sq） | Thickness （μm） | Width （mm） | Length （m） | Customized |
5065D1MT90W35R200 | ESD protection tape | 10K-1M | 90 | 35 | 200 | Yes |
5065D1MT90W35R400 | ESD protection tape | 10K-1M | 90 | 35 | 400 | Yes |
5065D1MT75W35R200 | ESD protection tape | 10K-1M | 75 | 35 | 200 | Yes |
5065D1MT75W35R500 | ESD protection tape | 10K-1M | 75 | 35 | 500 | Yes |
5065D1MT75W35R1000 | ESD protection tape | 10K-1M | 75 | 35 | 1000 | Yes |
5065D1MT50W35R500 | ESD protection tape | 10K-1M | 50 | 35 | 500 | Yes |
Bar-shaped chip packaging enterprises, for protection during the chip packaging process.
Bank card manufacturing factories, to protect bank card chips from electrostatic damage.
Mobile phone communication SIM card factories, to ensure the safety of SIM card chip production and storage.
(1) Chip Manufacturing for Bank Cards: Quality Upgrade Solution for a Leading Card Manufacturing Company
Customer Pain Points: The original use of ordinary conductive tape resulted in severe powder shedding, causing 1.2% of bank card chips to have yellow spots, leading to bank returns; and insufficient static protection, with a chip breakdown rate of 0.5% in winter with low humidity conditions.
Solution: Adopted Hager 75μm thick, 35mm wide model 5065D1MT75W35R500 tape, combined with customized grounding workbench pads.
Implementation Results:
a. The chip yellow spot rate dropped to 0.03%, and the return rate decreased by 97%;
b. The static breakdown rate dropped to 0.02%, and annual savings in rework costs reached 800,000 yuan;
c. The tape length was customized to 500m, reducing the frequency of rewinding and improving production efficiency by 15%.
Service Capabilities: From "Product Supply" to "Solution Output"
1. Customized Response Speed: Established a "48-hour rapid prototyping" mechanism. For instance, a mobile phone SIM card factory urgently requested the production of a 30mm-wide adhesive tape. The sample was delivered within 36 hours, which was 50% shorter than the industry average cycle.
2. Full Process Technical Support: Provides "Selection - Testing - Operation" full-cycle services. It can assist customers in establishing electrostatic protection systems (such as ground resistance detection, temperature and humidity calibration in a dust-free workshop), and after cooperation with a packaging factory, the occurrence rate of ESD events decreased by 80%.
3. Comprehensive After-sales Guarantee: Implements "Unconditional Return or Replacement for Quality Issues" and provides 1-on-1 technical support. The response time for after-sales service is ≤ 2 hours, and the resolution rate is 99%.
Question: What are the advantages of the surface resistance of this ESD protection tape ranging from 10K to 1M Ω/Sq?
In which scenarios is it applicable?
Answer: This resistance range belongs to the electrostatic dissipation type (10⁴ - 10⁹ Ω/Sq).Answer: This resistance range belongs to the electrostatic dissipation type (10⁴ - 10⁹ Ω/Sq). It can quickly release static electricity (in line with ESD STM11. It can quickly release static electricity (in line with ESD STM11.11 standard, with attenuation time ≤ 0.11 standard, with attenuation time ≤ 0.1 second), and avoids sparks caused by instantaneous discharge, perfectly suitable for medium-sensitive components such as bank card chips and SIM cards.1 second), and avoids sparks caused by instantaneous discharge, perfectly suitable for medium-sensitive components such as bank card chips and SIM cards. If used for highly sensitive components like wafers, a low-resistance model of 10³ - 10⁴ Ω/Sq can be customized, or an ion wind system can be combined to build a dual protection system. If used for highly sensitive components like wafers, a low-resistance model of 10³ - 10⁴ Ω/Sq can be customized, or an ion wind system can be combined to build a dual protection system.
Question: How to select the appropriate thickness (50μm/75μm/90μm)? Does it have any impact on the usage effect?
Answer: The core of selection depends on the protection requirements and operation scenarios:
50μm: Ultra-thin type, suitable for the compact packaging of small components such as SIM cards, saving storage space;
75μm: General type, balancing flexibility and protection, accounting for 60% of the company's sales volume, suitable for batch production of bank card chips;
90μm: Thickened type, the tear resistance is increased by 30%, suitable for long-distance transportation and fixation of heavy components such as OPC drums.
>>> Anti-static protective tape is also known as PE black conductive tape, black conductive roll
film, roll spacer protective film, black conductive coil film tape, strip chip card separator diaphragm
and so on.
This product is made of our exclusive formulation of black conductive polyethylene material,
with good electrostatic discharge performance and mechanical properties, tightly wound with the
protected product, no matter how long it is placed, it will not drop powder and dust, and will not
form macula or other impurities on the surface of the product.
Performance Advantages: It has excellent electrostatic discharge performance and mechanical properties, which can effectively protect sensitive products from electrostatic damage while having a stable physical structure.
Quality Assurance: After being tightly wrapped around the protected product, it will not shed powder, accumulate dust no matter how long it is placed, and will not form yellow spots or other impurities on the product surface, avoiding product contamination.
Appearance Features: The surface is smooth, flat, and free of wrinkles, with a matte texture and no particles, so it will not scratch the protected products (such as OPC drum cores, outer surfaces).
Customization Capability: Supports customization of parameters such as resistance, surface resistance, width, and length to meet the usage needs of different scenarios.
Model | Product | Surface resistance range （Ω/Sq） | Thickness （μm） | Width （mm） | Length （m） | Customized |
5065D1MT90W35R200 | ESD protection tape | 10K-1M | 90 | 35 | 200 | Yes |
5065D1MT90W35R400 | ESD protection tape | 10K-1M | 90 | 35 | 400 | Yes |
5065D1MT75W35R200 | ESD protection tape | 10K-1M | 75 | 35 | 200 | Yes |
5065D1MT75W35R500 | ESD protection tape | 10K-1M | 75 | 35 | 500 | Yes |
5065D1MT75W35R1000 | ESD protection tape | 10K-1M | 75 | 35 | 1000 | Yes |
5065D1MT50W35R500 | ESD protection tape | 10K-1M | 50 | 35 | 500 | Yes |
Bar-shaped chip packaging enterprises, for protection during the chip packaging process.
Bank card manufacturing factories, to protect bank card chips from electrostatic damage.
Mobile phone communication SIM card factories, to ensure the safety of SIM card chip production and storage.
(1) Chip Manufacturing for Bank Cards: Quality Upgrade Solution for a Leading Card Manufacturing Company
Customer Pain Points: The original use of ordinary conductive tape resulted in severe powder shedding, causing 1.2% of bank card chips to have yellow spots, leading to bank returns; and insufficient static protection, with a chip breakdown rate of 0.5% in winter with low humidity conditions.
Solution: Adopted Hager 75μm thick, 35mm wide model 5065D1MT75W35R500 tape, combined with customized grounding workbench pads.
Implementation Results:
a. The chip yellow spot rate dropped to 0.03%, and the return rate decreased by 97%;
b. The static breakdown rate dropped to 0.02%, and annual savings in rework costs reached 800,000 yuan;
c. The tape length was customized to 500m, reducing the frequency of rewinding and improving production efficiency by 15%.
Service Capabilities: From "Product Supply" to "Solution Output"
1. Customized Response Speed: Established a "48-hour rapid prototyping" mechanism. For instance, a mobile phone SIM card factory urgently requested the production of a 30mm-wide adhesive tape. The sample was delivered within 36 hours, which was 50% shorter than the industry average cycle.
2. Full Process Technical Support: Provides "Selection - Testing - Operation" full-cycle services. It can assist customers in establishing electrostatic protection systems (such as ground resistance detection, temperature and humidity calibration in a dust-free workshop), and after cooperation with a packaging factory, the occurrence rate of ESD events decreased by 80%.
3. Comprehensive After-sales Guarantee: Implements "Unconditional Return or Replacement for Quality Issues" and provides 1-on-1 technical support. The response time for after-sales service is ≤ 2 hours, and the resolution rate is 99%.
Question: What are the advantages of the surface resistance of this ESD protection tape ranging from 10K to 1M Ω/Sq?
In which scenarios is it applicable?
Answer: This resistance range belongs to the electrostatic dissipation type (10⁴ - 10⁹ Ω/Sq).Answer: This resistance range belongs to the electrostatic dissipation type (10⁴ - 10⁹ Ω/Sq). It can quickly release static electricity (in line with ESD STM11. It can quickly release static electricity (in line with ESD STM11.11 standard, with attenuation time ≤ 0.11 standard, with attenuation time ≤ 0.1 second), and avoids sparks caused by instantaneous discharge, perfectly suitable for medium-sensitive components such as bank card chips and SIM cards.1 second), and avoids sparks caused by instantaneous discharge, perfectly suitable for medium-sensitive components such as bank card chips and SIM cards. If used for highly sensitive components like wafers, a low-resistance model of 10³ - 10⁴ Ω/Sq can be customized, or an ion wind system can be combined to build a dual protection system. If used for highly sensitive components like wafers, a low-resistance model of 10³ - 10⁴ Ω/Sq can be customized, or an ion wind system can be combined to build a dual protection system.
Question: How to select the appropriate thickness (50μm/75μm/90μm)? Does it have any impact on the usage effect?
Answer: The core of selection depends on the protection requirements and operation scenarios:
50μm: Ultra-thin type, suitable for the compact packaging of small components such as SIM cards, saving storage space;
75μm: General type, balancing flexibility and protection, accounting for 60% of the company's sales volume, suitable for batch production of bank card chips;
90μm: Thickened type, the tear resistance is increased by 30%, suitable for long-distance transportation and fixation of heavy components such as OPC drums.
