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Wafer Separator/ Wafer Spacer/Wafer Pad
product model：JH5063
The WAFER PAD A wafer pad is also called an anti-static accumulation pap, a silicon wafer paper, a buffer pad in a semiconductor wafer box, A solar wafer buffer pad, a semiconductor wafer box inner pad, a PCB buffer pad, a conductive spacer, a black wafer spacer, an anti-static wafer spacer, a conductive wafer spacer, a circular wafer spacer, a wafer square, and the surface treatment process thereof is also called an anti-static black embossed wafer pad, an embossed wafer square, and the like.
This product is made of permanent conductive or anti-static film through hot-pressing, die-cutting. Film surface can be made smooth, can also be made according to the requirements of a variety of patterns. The product can be made into any size and shape according to the requirements, and the finished product has excellent dimensional stability, clean appearance, no powder falling and no dust. Protruding patterned wafer pads can not only effectively prevent the product from electrostatic damage, but also play a certain role in cushioning.
Such products are widely used in chip manufacturing, packaging and other enterprises TFT-LCD, solar cell wafer, wafer, solar silicon wafer packaging of multi-monocrystalline silicon wafer.
Flexible material selection: Two basic materials, PE and PS, are provided to meet the needs of different scenarios.
Highly customizable: Supports customization of size (inches / millimeters), shape, surface patterns (dot embossing, smooth or other custom styles), and thickness, suitable for a variety of usage scenarios.
Stable performance: It has stable anti-static ability, with surface resistance ranging from 10K-1MΩ/Sq and 1G-100GΩ/Sq, effectively preventing static electricity from damaging products; the finished product has excellent dimensional stability, a clean appearance, and no powder shedding or dust accumulation issues.
Dual protection function: In addition to anti-static, the wafer pad with raised patterns also has a buffering and protective effect, reducing collision damage during product transportation or storage.
Model | Material | Size (in) | Diameter (mm) | Surface Resistance (Ω/Sq) | Thickness（μm） | Surface |
JH5063PE | PE | 4/5/6/6.5/7/ 8/10/11/ 12/14/15/16/ Customized | 100/125/150(152,155)/ 165/180(178)/200(203)/ 254/275/300(299,305)/360 /380(390)/400/ Customized | 10K-1M/ 1G-100G | 100/ Customized | Embossed with dots/Smooth/ Customized |
JH5063PS | PE | 4/5/6/6.5/7/ 8/10/11 /12/14/15 /16/ Customized | 100/125/150(152,155)/ 165/180(178)/200(203)/ 254/275/300(299,305)/360 /380(390)/400/ Customized | 10K-1M/ 1G-100G | 100/ Customized | Embossed with dots/Smooth/ Customized |
Question: What key parameters need to be provided when customizing the product size? What is the maximum customizable wafer diameter?
Answer: Three core parameters need to be provided for customization: ① The specific size of the wafer (in inches or millimeters in diameter, for example, 6 inches corresponds to 150mm, and special sizes need to specify the exact value); ② The required thickness (conventional 100μm, customization needs to specify the exact micrometer value); ③ Surface treatment requirements (dot embossing, smooth surface or other customized patterns). Currently, the maximum standard customization diameter supported is 400mm. For special requirements exceeding this size, please communicate with the technical team for a suitable solution.
Question: How long is the delivery time for custom products? Do you offer sample testing services?
Answer: The delivery time for custom orders depends on the order size: for regular-sized customizations (such as standard inch specifications and common thicknesses), the delivery time is 3 to 7 working days; for special sizes (such as non-standard diameters and custom patterns) or large orders (over 100,000 pieces), the delivery time is 7 to 15 working days. Free sample testing services are provided for all models. The sample quantity is usually 5 to 10 pieces, and the sample delivery time is 1 to 3 working days. Customers can verify the size fit, anti-static performance, and cleanliness through the samples to see if they meet the requirements.
Case 2: TFT-LCD Wafer Interference Protection Project of a Semiconductor Packaging Factory
Project Background: This packaging factory specializes in the packaging of TFT-LCD driver chips, using 8-inch (200mm) wafers for processing. Previously, they used imported wafer separators, which had high costs (the unit price was 2.5 times that of domestic products) and long delivery times (an average of 25 days). With the surge in order volume, the supply cycle of imported products could no longer meet production needs, and a more cost-effective domestic alternative solution was urgently needed.
Adaptation Solution: Haoge Technology provided the customized model JH5063PS, specifically addressing the core requirements: ① Customizing the shape according to the customer's wafer box size, with a smooth surface to ensure no scratches on the wafer surface; ② Controlling the size tolerance through precise die-cutting technology within ±0.1mm, meeting the requirements for the adaptation of the automated assembly line; ③ Optimizing the production process, compressing the delivery time to within 10 days, and providing monthly stock preparation services.
Implementation Effect: After the domestic substitution, the product unit price decreased by 60%, and annual procurement costs were saved by approximately 1.2 million yuan; the delivery time was shortened by 60%, completely resolving the bottleneck in order delivery; after 6 months of batch usage verification, the wafer packaging yield increased slightly from 97.5% to 97.8%, and the performance was on par with the imported product, successfully passing the customer's qualified supplier certification.
Wafer Separator/ Wafer Spacer/Wafer Pad
product model：JH5063
The WAFER PAD A wafer pad is also called an anti-static accumulation pap, a silicon wafer paper, a buffer pad in a semiconductor wafer box, A solar wafer buffer pad, a semiconductor wafer box inner pad, a PCB buffer pad, a conductive spacer, a black wafer spacer, an anti-static wafer spacer, a conductive wafer spacer, a circular wafer spacer, a wafer square, and the surface treatment process thereof is also called an anti-static black embossed wafer pad, an embossed wafer square, and the like.
This product is made of permanent conductive or anti-static film through hot-pressing, die-cutting. Film surface can be made smooth, can also be made according to the requirements of a variety of patterns. The product can be made into any size and shape according to the requirements, and the finished product has excellent dimensional stability, clean appearance, no powder falling and no dust. Protruding patterned wafer pads can not only effectively prevent the product from electrostatic damage, but also play a certain role in cushioning.
Such products are widely used in chip manufacturing, packaging and other enterprises TFT-LCD, solar cell wafer, wafer, solar silicon wafer packaging of multi-monocrystalline silicon wafer.
Flexible material selection: Two basic materials, PE and PS, are provided to meet the needs of different scenarios.
Highly customizable: Supports customization of size (inches / millimeters), shape, surface patterns (dot embossing, smooth or other custom styles), and thickness, suitable for a variety of usage scenarios.
Stable performance: It has stable anti-static ability, with surface resistance ranging from 10K-1MΩ/Sq and 1G-100GΩ/Sq, effectively preventing static electricity from damaging products; the finished product has excellent dimensional stability, a clean appearance, and no powder shedding or dust accumulation issues.
Dual protection function: In addition to anti-static, the wafer pad with raised patterns also has a buffering and protective effect, reducing collision damage during product transportation or storage.
Model | Material | Size (in) | Diameter (mm) | Surface Resistance (Ω/Sq) | Thickness（μm） | Surface |
JH5063PE | PE | 4/5/6/6.5/7/ 8/10/11/ 12/14/15/16/ Customized | 100/125/150(152,155)/ 165/180(178)/200(203)/ 254/275/300(299,305)/360 /380(390)/400/ Customized | 10K-1M/ 1G-100G | 100/ Customized | Embossed with dots/Smooth/ Customized |
JH5063PS | PE | 4/5/6/6.5/7/ 8/10/11 /12/14/15 /16/ Customized | 100/125/150(152,155)/ 165/180(178)/200(203)/ 254/275/300(299,305)/360 /380(390)/400/ Customized | 10K-1M/ 1G-100G | 100/ Customized | Embossed with dots/Smooth/ Customized |
Question: What key parameters need to be provided when customizing the product size? What is the maximum customizable wafer diameter?
Answer: Three core parameters need to be provided for customization: ① The specific size of the wafer (in inches or millimeters in diameter, for example, 6 inches corresponds to 150mm, and special sizes need to specify the exact value); ② The required thickness (conventional 100μm, customization needs to specify the exact micrometer value); ③ Surface treatment requirements (dot embossing, smooth surface or other customized patterns). Currently, the maximum standard customization diameter supported is 400mm. For special requirements exceeding this size, please communicate with the technical team for a suitable solution.
Question: How long is the delivery time for custom products? Do you offer sample testing services?
Answer: The delivery time for custom orders depends on the order size: for regular-sized customizations (such as standard inch specifications and common thicknesses), the delivery time is 3 to 7 working days; for special sizes (such as non-standard diameters and custom patterns) or large orders (over 100,000 pieces), the delivery time is 7 to 15 working days. Free sample testing services are provided for all models. The sample quantity is usually 5 to 10 pieces, and the sample delivery time is 1 to 3 working days. Customers can verify the size fit, anti-static performance, and cleanliness through the samples to see if they meet the requirements.
Case 2: TFT-LCD Wafer Interference Protection Project of a Semiconductor Packaging Factory
Project Background: This packaging factory specializes in the packaging of TFT-LCD driver chips, using 8-inch (200mm) wafers for processing. Previously, they used imported wafer separators, which had high costs (the unit price was 2.5 times that of domestic products) and long delivery times (an average of 25 days). With the surge in order volume, the supply cycle of imported products could no longer meet production needs, and a more cost-effective domestic alternative solution was urgently needed.
Adaptation Solution: Haoge Technology provided the customized model JH5063PS, specifically addressing the core requirements: ① Customizing the shape according to the customer's wafer box size, with a smooth surface to ensure no scratches on the wafer surface; ② Controlling the size tolerance through precise die-cutting technology within ±0.1mm, meeting the requirements for the adaptation of the automated assembly line; ③ Optimizing the production process, compressing the delivery time to within 10 days, and providing monthly stock preparation services.
Implementation Effect: After the domestic substitution, the product unit price decreased by 60%, and annual procurement costs were saved by approximately 1.2 million yuan; the delivery time was shortened by 60%, completely resolving the bottleneck in order delivery; after 6 months of batch usage verification, the wafer packaging yield increased slightly from 97.5% to 97.8%, and the performance was on par with the imported product, successfully passing the customer's qualified supplier certification.
